Product specifications
FCM363X
MCU Wi-Fi 6 and Bluetooth 5.2 module
FCM363X is a cutting-edge MCU Wi-Fi and Bluetooth module launched by Quectel. It boasts a high-performance processor (ARM Cortex-M33) with a frequency of up to 260MHz and supports IEEE 802.11a/b/g/n/ac/ax protocol and BLE 5.3. The module features built-in 1.2MB SRAM and 8MB flash, ensuring efficient performance. The module also offers optional PSRAM expansion for more complex applications. In addition, it complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards, providing an AES-128 encryption algorithm.
FCM363X is in LCC + LGA form factor with an ultra-compact package size of 25.5mm × 18.0mm × 3.16mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
FCM363X supports GPIO, SDIO, UART, USB, SPI and JTAG interfaces by default and I2C, I2S, ADC, LCD and PWM interfaces in QuecOpen® solution, and many low power consumption modes and keep-alive mechanism, which provide flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios.
FCM363X supports QuecOpen® solution and standard AT commands, with a compact protocol, and can realize efficient product development for customers.
Features:
- Wi-Fi 6 module, 2.4GHz/ 5GHz Wi-Fi bands, 1 ×1 antennna
- Bluetooth Low Energy (BLE 5.3)
- Large memory, 1.2MB SRAM and 8MB flash
- PSRAM expansion (optional)
- Supports GPIO, SDIO, UART, USB, SPI, and JTAG
- RF coaxial connector*, PCB antenna (optional)
Summary:
- Wi-Fi 6 and BLE 5.2 module
- LGA and LCC form factor
- IEEE 802.11a/b/g/n/ac/ax
- Approx 1.51g
- 25.5mm × 18.0mm × 3.16mm
- Operating temperature range: -40°C to +85°C
- Quectel Wireless Solutions product -
