Product specifications
FGM840R - Wi-Fi 4 & BLE 5.0 Module Compact LGA Package
OVERVIEW:
FGM840R is a cutting-edge MCU Wi-Fi 4 and Bluetooth combo module launched by Quectel. It has a built-in Cortex M33 and M23 dual-core processor with a main-core frequency of up to 200 MHz. It supports IEEE 802.11a/b/g/n protocol and BLE 5.0, supports 2.4 GHz and 5 GHz frequency bands, and has built-in 512 KB RAM and 4 MB flash.
The module is in an LGA form factor with an ultra-compact package size of 12.5 mm × 13.2 mm × 2.05 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
The module complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards, supports comprehensive security such as TRNG (true random number generator), AES-128, TrustZone, Secure Boot and flash encryption.
The module supports up to 20 GPIO interfaces, which can be multiplexed as UART, SPI, I2C, ADC, PWM, SDIO and USB functions, which provide flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios.
The module supports QuecOpen® solution and standard AT commands, with a compact protocol, and can realize efficient product development for customers.
KEY FEATURES:
- Wi-Fi 4 module, 2.4 GHz and 5 GHz Wi-Fi bands, 1 × 1 antenna
- BLE 5.0 and Wi-Fi pairing via Bluetooth
- Built-in 512 KB SRAM, 4MB flash
- Supports IEEE 802.11 a/b/g/n
- Supports up to 20 GPIOs for UART, SPI, I2C, ADC, PWM, SDIO and USB functions in QuecOpen® solution
- RF coaxial connector or pin antenna interface (optional)
- Wide operating temperature range
SUMMARY:
- Wi-Fi 4 dual-band and BLE 5.0 module
- LGA form factor
- 12.5 mm × 13.2 mm × 2.05 mm
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -45 °C to +95 °C
- Quectel Wireless Solutions product -
