Ultra-compact Wi-Fi 6 and Bluetooth 5.1 module - FCM360W - Quectel

June 8, 2023

Ideal for smart homes and industrial IoT use cases

Quectel Wireless Solutions has launched its latest Quectel FCM360W Wi-Fi and Bluetooth module, combining a high-performance processor with Wi-Fi 6 and Bluetooth 5.1 capabilities. With large memory including 512KB SRAM and 4MB of flash memory, the FCM360W is highly versatile, offering a blend of processing power, memory, connectivity and security.

FCM360W is a cutting-edge MCU Wi-Fi and Bluetooth module. It boasts a high-performance processor with a frequency of up to 240MHz and supports IEEE 802.11b/g/n/ax protocol and Bluetooth 5.1.

The module features built-in 512KB SRAM and 4MB/8MB flash, ensuring efficient performance and features standard security features such as WPA-PSK, WPA2-PSK and WPA3-PSK security standards and provides 128-bit AES encryption for added security. The FCM360W supports multiple interfaces including UART, SPI, I2C, I2S, ADC and PWM alongside many low power consumption modes and keep-alive mechanisms, which provide flexibility and versatility for a range of applications, especially in smart homes and industrial IoT (IIoT) use cases.

Quectel’s FCM360W Wi-Fi 6 and Bluetooth 5.1 module is offered in an LCC form factor with an ultra-compact package size of 25.5mm x 18.0mm x 3.2mm, which optimizes the size and cost for end-products and is compatible with diverse designs, providing great flexibility for developers. The module offers support for multiple interfaces across 19 GPIOs, allowing for multi-channel SSL connections and local caching of large amounts of data. This makes it ideal for use cases such as photovoltaic inverters, energy storage batteries and other smart devices that require long-term data monitoring and storage. Additionally, the module has an operating temperature range of -40°C to +85°C and comes with antenna options that include RF coaxial connector, external antenna pin or PCB antenna.

The FCM360W with Wi-Fi 6 and Bluetooth 5.1 in a compact form factor and a high-performance processor and large memory, provides greater choices and flexibility for developers and device OEMs. FCM360W supports the QuecOpen® solution, and has a user-friendly protocol stack and large memory. This allows for multi-channel SSL connections and local cache of large amounts of data, making it especially suitable for photovoltaic inverters, energy storage batteries and other smart devices that require long-term data monitoring and storage.

Summery

• MCU Wi-Fi 6 and Bluetooth 5.1 module
• LCC form factor
• 25.5mm × 18.0mm × 3.2mm
• 1.65g
• Operating temperature of -40°C to +85°C