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High-performance MCU Thread, Zigbee and BLE module - Quectel

November 18, 2025

This high-performance MCU Thread, Zigbee and BLE module boasts an ARM Cortex-M33 processor with a frequency of up to 78 MHz, and supports Matter, Thread, Zigbee, BLE 6.0, and BLE mesh. The module features built-in 256 KB SRAM and 1536 KB/ 2.5 MB/ 3.5 MB flash, ensuring efficient performance. The KGM133S is in an LGA form factor with an ultra-compact size, which optimizes the size and cost for end-products and is compatible with diverse designs.

It can support up to 21 GPIOs in the case of multiplexing, which can be used for interfaces including I2C, USART, SPI, I2S, etc. It also features an superior sensitivity of -105 dBm and a transmit power of up to +19.5 dBm, providing flexibility and versatility for a range of applications. KGM133S supports standard Thread, Zigbee or Bluetooth mesh networking, increasing network scalability and node counts with mesh topology, which is suitable for devices that enables many-to-many communications, smart lighting, smart buildings and home smart wireless networks. And the module offers an enhanced security option, Secure Vault, featuring a higher level of IoT security.

Key features

  • Matter 1.4, Thread 1.4, Zigbee 3.0, BLE 6.0
  • 256 KB SRAM and 1536 KB/2.5 MB/3.5 MB flash (optional)
  • Thread, Zigbee, BLE mesh networking
  • 21 GPIOs which can be used for interfaces including I2C, USART, SPI, I2S, etc.
  • Operating temperature range: -40 °C to +105 °C
  • 4th generation RF coaxial connector/ pin antenna (optional)
  • 12.5 mm × 13.2 mm × 2.2 mm
  • LGA form factor

 

The KGM133S, is the first in a range of Matter over Thread modules that provides innovative solutions for applications such as smart door locks, sensors, and lighting, helping the smart home industry overcome connectivity barriers and advance toward a new era of more efficient and seamless development.

The KGM133S series modules are built based on the Silicon Labs EFR32MG24 chip, supporting the latest Matter 1.4 protocol. The modules are designed to enable seamless linkage of smart home devices across ecosystems, including Apple Home, Google Home, Amazon Alexa, and Samsung SmartThings.

Leveraging the powerful combination of Matter and Thread, Quectel’s KGM133S series delivers robust, scalable connectivity to power all-scenario IoT solutions. Built on the IEEE 802.15.4 standard, Thread natively supports globally unique IPv6 addressing, enabling seamless IP-based connectivity. Unlike Zigbee, Thread devices don’t rely on gateways for complex protocol conversions – they connect directly to the Internet via a Border Router, simplifying network architecture and dramatically reducing latency. With its core advantages of low power consumption and high reliability, Thread has become a cornerstone technology for the Matter ecosystem.

The KGM133S Matter over Thread module series features 256KB SRAM and offers three Flash capacity options: 1536KB, 2.5MB, and 3.5MB. This not only meets the development needs of various current smart home applications but also reserves sufficient space for future version upgrades and function expansion of the Matter protocol, ensuring that end products maintain long-term market competitiveness.

With outstanding performance, ultra-low power consumption, and a compact design, the KGM133S series stands out as a well-rounded solution built to meet the demands of a wide range of IoT applications.

  • High Performance: Modules in this series feature an ARM Cortex-M33 processor with a maximum frequency of 78MHz, enabling efficient processing of complex data instructions.
  • Low Power Consumption: In terms of power consumption, based on the 802.15.4 Thread protocol, they adopt a low-power design, making them well-suited for battery-powered devices.
  • Small Size: These modules are offered in LGA packaging with two size options: 12.5 × 13.2 × 2.2 mm (KGM133S), featuring a fourth-generation IPEX or pin antenna, and 12.5 × 16.6 × 2.2 mm (KGM133S-P), equipped with an onboard PCB antenna. This flexibility enables seamless integration into a wide range of compact and slim terminal designs, supporting diverse structural requirements.
  • Multiple Interfaces: Supporting up to 26 GPIOs that can be multiplexed as I²C, UART, SPI, or I²S interfaces, the module enables seamless integration with a wide range of peripherals, meeting the development requirements of feature-rich devices.
  • High Power: With a receiving sensitivity better than –105 dBm and an optional maximum transmit power of 19.5 dBm, the module maintains stable, reliable signal transmission even in complex environments with walls or multi-device interference.
  • Ultra-Wide Temperature Range: Supporting an ultra-wide operating temperature range of -40 to +105°C, the Matter over Thread module series can cope with extreme environments

In addition to supporting the Matter over Thread protocol, the KGM133S Matter over Thread module series also integrates Zigbee 3.0 and Bluetooth LE 6.0 providing developers with additional connectivity options. The series further incorporates the Secure Vault enhanced security feature, providing a higher level of protection for IoT devices and data.

With its outstanding performance and flexible adaptability, the KGM133S not only meets the urgent needs of current all-scenario connectivity in smart homes but also points out the direction for the future development of the industry.

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