High-performance MCU BLE 5.4 module which boasts an ARM Cortex M33 processor - HCM010S - Quectel
February 28, 2024
Quectel has launched the Quectel HCM010S, high-performance MCU Bluetooth module which boasts an ARM Cortex M33 processor and supports both Bluetooth Low Energy (BLE) and Bluetooth Mesh technologies.
The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. The HCM010S is provided in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm.
Able to operate in temperatures from -40°C to +105°C, the Quectel HCM010S supports standard Bluetooth mesh network and is suitable for BLE devices that enable many-to-many communications for use cases in smart lighting, smart building and smart home wireless networks. The module also supports Tx power up to +20dBm for longer transmission range ensuring robust and reliable communication. Importantly, the module offers Secure Vault, an enhanced security option that features a higher level of IoT security.
HCM010S is a high-performance MCU Bluetooth module launched by Quectel. It boasts a ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports BLE 5.4 and BLE Mesh. The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. HCM010S is in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
HCM010S supports up to 20 GPIOs for UART, SPI, I2C and other functions in QuecOpen® solution, features superior sensitivity of -104 dBm and transmit power of up to +20 dBm and Bluetooth low power mode, which provide flexibility and versatility for a range of applications.
HCM010S supports standard Bluetooth mesh networking, increasing network scalability and node counts with mesh topology, which is suitable for BLE devices that enables many-to-many communications, smart lighting, smart buildings and home smart wireless networks. And the module offers an enhanced security option, Secure Vault, featuring a higher level of IoT security.
Summery
- BLE 5.4 module
- LCC + DIP form factor
- 20.0mm × 15.6mm × 2.4mm
- 1.14 g
- Operating temperature of -40 °C to +105 °C
Key Features
- BLE 5.4
- 64KB SRAM and 768KB flash
- Bluetooth mesh networking
- 20 GPIOs for I2C, UART, SPI, I2S functions in QuecOpen®solution
- Operating temperature range: -40°C to +105°C
- PCB antenna
Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.
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Contact us to learn more about this MCU BLE 5.4 module.
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