Product specifications
MCU Wi-Fi 6 and Bluetooth 5.1 module
FCM360W is a cutting-edge MCU Wi-Fi and Bluetooth module launched by Quectel. It boasts a high-performance processor with a frequency of up to 240MHz and supports IEEE 802.11b/g/n/ax protocol and Bluetooth 5.1.
The module features built-in 512KB SRAM and 4MB/8MB flash, ensuring efficient performance. In addition, it complies with WPA-PSK, WPA2-PSK and WPA3-PSK security standards, providing 128-bit AES encryption for added security. FCM360W comes in a LCC form factor with an ultra-compact package size of 25.5mm × 18.0mm × 3.2mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
FCM360W supports multiple interfaces including UART, SPI, I2C, I2S, ADC and PWM, and many low power consumption modes and keep-alive mechanism, which provide flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios.
FCM360W supports the QuecOpen® solution, and has a user-friendly protocol stack and large memory. This allows for multi-channel SSL connections and local cache of large amounts of data, making it especially suitable for photovoltaic inverters, energy storage batteries and other smart devices that require long-term data monitoring and storage.
Features:
- Wi-Fi 6 module, single band (2.4 GHz) Wi-Fi, 1 × 1 antenna
- Bluetooth 5.1 and Bluetooth pairing
- Large memory, 512 KB SRAM and 4 MB/ 8 MB flash
- Multiple interfaces, 19 GPIOs
- UART, SPI, I2C, I2S, ADC and PWM
- RF coaxial connector, external antenna pin, PCB antenna (optional)
- SPI interface available for Ethernet solution
Summary:
- MCU Wi-Fi 6 and Bluetooth 5.1 module
- LCC form factor
- 25.5mm × 18.0mm × 3.2mm
- 1.65g
- Operating temperature of -40°C to +85°C
- Quectel Wireless Solutions product -
