Smart module sets the pace for Edge AI with 100 TOPS of computing power - Quectel

November 13, 2026

The SP900BF-AP is Quectel’s next-generation flagship Ubuntu/Yocto Linux smart module powered by Qualcomm’s flagship IoT chipset, the IQ9075. The module integrates an up-to-octacore high-performance Kryo™ CPU, Adreno™ 663 GPU, Adreno DPU 1199, Adreno 765 VPU, Hexagon™ DSP, and Spectra™ ISP. Delivering high compute power and rich multimedia capabilities, it meets demanding customer requirements for edge computing, high-throughput processing, and advanced multimedia features across both industrial and consumer applications.

In addition, the SP900BF-AP provides a comprehensive array of peripheral interfaces, including LCM, camera, touch screen, I2S, PCIe, UART, USB, I2C, and SPI. This extensive connectivity significantly expands its versatility in machine-to-machine (M2M) deployments, making it ideal for use in end devices and vertical markets such as edge gateways, edge AI boxes, drones, robotics, and industrial PCs.

Key features

• Next-generation flagship smart module
• Ubuntu/Yocto Linux
• LGA package
• 65 mm × 65 mm × 4.55 mm
• Operating temperature range of -40°C ~ +85°C

• 4 × Kryo Gold Prime @ 2.36GHz + 4 × Kryo Gold Prime @ 2.36GHz
• Adreno 663 GPU
• Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
• Spectra ISP
• Adreno 765 VPU
• Adreno DPU 1199
   
• Neural processing unit
• Secure processing unit
• Video encoding: 4K @ 120fps
• Video decoding: 4K @ 240fps
• Up to 100 TOPS AI compute performance

Contact the TOP-electronics team to learn more about this SP900BF-AP smart module for Edge AI